Method for encapsulating an integrated semi-conductor circuit,申请号EP19970201750-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Method for encapsulating an integrated semi-conductor circuit
摘要
申请公布号	EP0813236(B1)	申请公布日期	2007.01.17
申请号	EP19970201750	申请日期	1997.06.10
申请人	ELMOS ADVANCED PACKAGING B.V.	发明人	KALDENBERG, PETER JACOBUS
分类号	H01L21/56;H01L23/31	主分类号	H01L21/56
代理机构		代理人
主权项
地址

您可能感兴趣的专利

ENCODER OF MULTIGRADATION PICTURE SIGNAL

X RAYS DETECTION TUBE

EARTHQUAKE-PROOF SUPPORTER FOR REACTOR VESSEL OF FAST BREEDER REACTOR

VOICE RECOGNITION EQUIPMENT

PHOTOSENSITIVE POLYCONDENSATING PRODUCT AND PHOTOSENSITIVE RECORDING MATERIAL

ULTRAVIOLET CURING DEVICE

REGULATOR FOR GLUTEN-REMOVING ROLL CLEARANCE OF RICE HULLER

METHOD AND APPARATUS FOR FORMING STRAND COMPRISING FIBER IN TOBACCO PROCESSING INDUSTRY

HIGH FREQUENCY HEATER

MANUFACTURE OF EL PANEL

PIPERAZINE DERIVATIVE, MANUFACTURE AND NOVEL PSYCHOTROPIC COMPOSITION CONTAINING SAME AS EFFECTIVE COMPONENT

(A) ;ANTIBACTERIAL AGENT AND ANTIBACTERIAL HAIR TREATMENT COMPOSITION CONTAINING SAME

PACKAGING MACHINE

NOVEL PYRIMIDINE METHANOL DERIVATIVE AND MEDICINAL COMPOSITION

ENOL ETHERS, MANUFACTURE, ALPHA-PYRONES, MANUFACTURE AND USE

CRUSHING DRIER FOR INDUSTRIAL WASTE

FLOOR OF RIDING PADDY FIELD AGRICULTURAL WORKING MACHINE