| 摘要 |
A light emitting package ( 8, 8', 8'', 208, 408 ) includes a printed circuit board ( 10, 10', 10'', 210, 410 ) supporting at least one light emitting die ( 12, 12'', 14, 16, 212, 412 ). A light transmissive cover ( 60, 60', 60'', 260, 460 ) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter ( 62, 62', 62'', 262, 462 ) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume ( 70, 70'', 270, 470 ) containing the at least one light emitting die. An encapsulant ( 76, 76'', 276, 278, 476 ) is disposed in the interior volume and covers at least the light emitting die. |
