| 摘要 |
External connection terminals (27) which are electrically connected to semiconductor chips (11-1,11-2,12-1,12-2) and also protrude beyond the semiconductor chips (11-1,11-2,12-1,12-2) are disposed on a substrate (13) on the side to which the plural semiconductor chips (11-1,11-2,12-1,12-2) are connected. |
