Circuitized substrate and method of making same

摘要

A method of making a circuitized substrate in which a commoning layer (15, 65, 67) is used to form multiple, substantially vertically aligned conductive openings (13) in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like. The structure, including such a chip and circuit board is ideally suited for use within an information handling system.