Method of formation of gate stack spacer and charge storage materials having reduced hydrogen content in charge trapping dielectric flash memory device

摘要

The present invention, in one embodiment, relates to a process for fabricating a charge trapping dielectric flash memory device including steps of providing a semiconductor substrate having formed thereon a gate stack comprising a charge trapping dielectric charge storage layer and a control gate electrode overlying the charge trapping dielectric charge storage layer; forming an oxide layer over at least the gate stack; and depositing a spacer layer over the gate stack, wherein the depositing step deposits a spacer material having a reduced hydrogen content relative to a hydrogen content of a conventional spacer material.