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经营范围
发明名称
WAFER LEVEL PACKAGE
摘要
申请公布号
KR100668809(B1)
申请公布日期
2007.01.16
申请号
KR20000037367
申请日期
2000.06.30
申请人
发明人
分类号
H01L23/12
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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