| 摘要 |
A chip bonding apparatus is provided to maintain the minimum pressure during bonding of a semiconductor chip, thereby performing an accurate bonding process, by controlling the pressure using a motor. A motor(210) rotates centering on a predetermined rotary shaft(211). The motor is installed at a supporter(220). A compressing part(230) is connected to the rotary shaft. The compressing part moves in a predetermined direction according to rotation of the motor, and controls the pressure for bonding a semiconductor chip. Guide parts(240,250) are installed at the supporter, and connected to the compressing part. The guide parts guide the moving path of the compressing part moving according to rotation of the motor. |
