| 摘要 |
A chip bonding apparatus is provided to prevent the heat generated at a heater from being transferred to other component parts during boding of a semiconductor chip, by installing a heat insulating part adjacently to the heater. A heater(210) generates a heat while a semiconductor chip is thermally compressed on an LCD panel. A heat insulating part(220) is positioned adjacently to the heater, and prevents the heat from being radiated to the outside. A cooling part(230) cools the heat insulating part. A plurality of holes is formed in surfaces except the surface contacted with the heater, in the heat generating part. |
