RESIN MOLDING TYPE BGA PACKAGE HAVING SOLDER RESIST DAM

摘要

A resin-molding BGA with a solder resist dam is provided to reduce fabricating costs by minimizing use of adhesive while avoiding delamination caused by a difference of a thermal expansion coefficient. A plurality of solder resist damps(21a,21b) are formed on one surface of a substrate(15), separated from each other. A semiconductor chip(11) is attached to the upper surface of the solder resist dams. The substrate is electrically connected to the semiconductor chip by bonding wires(35). The semiconductor chip is sealed by a resin molding part(37) filled between the semiconductor chip and the substrate. The solder resist dams can be solder resist dams of an island type formed at the corner of the semiconductor chip.