发明名称 DIELECTRIC INTERCONNECT FRAME INCORPORATING EMI SHIELD AND HYDROGEN ABSORBER FOR TILE T/R MODULES
摘要 <p>A frame structure for a T/R tile module configured to transmit and receive electromagnetic radiation over a predetermined portion of the electromagnetic spectrum is provided. The frame component comprises at least one frame component formed as a single piece from a synthetic resin dielectric material. The frame component is configured to support a plurality of electrical connectors, and has a thin film coating configured to provide a ground connection and electromagnetic shield when the frame structure is incorporated into a transmit/receive module. A portion of the frame component is configured to interface with a portion of a T/R module when the frame component is incorporated into the T/R module, and the synthetic resin dielectric material provides the frame component with a range of compressibility that enables the frame component to provide the module with an effective ground connection over that range of compressibility.</p>
申请公布号 KR100668014(B1) 申请公布日期 2007.01.16
申请号 KR20057001757 申请日期 2005.01.31
申请人 发明人
分类号 H01L25/18;H01Q23/00;H01L23/26;H01L23/552;H01L25/04;H01Q21/00 主分类号 H01L25/18
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