CAPACITIVE DEVICES, ORGANIC DIELECTRIC LAMINATES, MULTILAYER STRUCTURES INCORPORATING SUCH DEVICES, AND METHODS OF MAKING THEREOF

摘要

A capacitive device, an organic dielectric laminate, a multilayer structure including the device, and a method for fabricating the same are provided to minimize delay due to loop inductance by positioning dielectric compositions and films adjacent to a semiconductor device. A dielectric composition comprising a paraelectric filler and polymer is prepared. The paraelectric filler has a dielectric constant of 50 to 150. The dielectric composition is applied onto a carrier film to form a multilayer film having a dielectric layer and carrier film layer. The multilayer film is laminated on a circuitized core. The dielectric layer of the multilayer film faces the circuitized core. The carrier film layer is removed from the dielectric layer. A metallic layer is applied onto the dielectric layer. The circuitized core, the dielectric layer and the metallic layer form a planar capacitor. The planar capacitor is processed to form a multilayer structure.