| 摘要 |
A high frequency package device is provided to prevent a high frequency package device from being enlarged by protruding a part of the back surface of a cover body. A sidewall(13) is formed on a bottom wall(11) to surround a space on the bottom wall. An opening of the sidewall part is closed by a cover body(16) wherein the sidewall part and the cover body constitute an inner space(17) on the bottom wall. A dielectric substrate(18) is disposed on the bottom wall in the inner space. An input line penetrates the sidewall. An output line penetrates the sidewall. A protrusion region(19) is formed on the back surface of the cover body to reduce a distance with the bottom wall. The bottom wall, the sidewall, the cover body and the protrusion region are made of metal. The protrusion region can be positioned between the input line and the output line. |
