发明名称 |
PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRIC ELEMENT AND FABRICATING METHOD THEREFOR |
摘要 |
A printed circuit board embedded with electric elements and a method of manufacturing the same are provided to reduce a volume by not including a separate adhesive layer for embedding the electric elements. A printed circuit board includes a copper film stacked plate having through-holes(31) for accommodating electric elements(60,60'), an insulation layer and a conductor circuit layer alternatively stacked on the copper film stacked plate, and a via hole(70) connecting the conductor circuit layer with an electrode of the electric element. The insulation layer has a reinforcing substrate and a resin applied on a surface of the reinforcing unit. Plural through-holes are formed on the copper film stacked plate. |
申请公布号 |
KR20070007583(A) |
申请公布日期 |
2007.01.16 |
申请号 |
KR20050062294 |
申请日期 |
2005.07.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, JOON SUNG;YOO, JE GWANG;RYU, CHANG SUP;CHO, HAN SEO;AHN, JIN YONG;CHO, SUK HYEON |
分类号 |
H05K1/18;H05K1/11;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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