LIGHT-EMITTING DIODE PACKAGE STRUCTURE, COLD CATHODE FLUORESCENT LAMP AND PHOTOLUMINESCENT MATERIAL THEREOF

摘要

A structure of an LED package is provided to efficiently simplify a whole process for assembling LED packages by using a photoluminescent material instead of a fluorescent layer and a diffusion layer. An LED chip is disposed on a carrier(200) to emit light. The LED chip on the carrier is sealed by a sealing member(220). A photoluminescent material(230) is distributed in the sealing member. The photoluminescent material is excited by the light emitted from the LED chip and the light is scattered. The carrier can be a PCB, and the LED chip is electrically connected to the PCB.