| 摘要 |
A semiconductor package flip apparatus and a method thereof are provided to improve a flip speed of semiconductor packages and to enhance the yield of the semiconductor packages by storing sequentially flip state semiconductor packages in a magazine using a flip unit. A semiconductor package flip apparatus includes an unflip semiconductor supply unit(1100) for supplying an unflip carrier with unflip semiconductor packages, a flip carrier supply unit(1200) for supplying a flip carrier without semiconductor packages, a flip unit, a flip carrier exhaust unit, and a flip semiconductor package exhaust unit. The flip unit(1300) is used for rotating the unflip carrier and the flip carrier. The flip carrier exhaust unit(1400) for exhausting the flip carrier from the flip unit. The flip semiconductor package exhaust unit(1500) is used for exhausting the unflip carrier from the flip unit.
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