| 摘要 |
A method for measuring the concentration of a leveler in a plating solution for a plating apparatus being used for filling a metal such as copper into a groove or hole formed for wiring in the surface of, for example, a semiconductor substrate or the like, characterized in that the leveler concentration is determined based on the peak area (Ar value) in a peeling region of the plating solution as measured by the CV method or CVS method. ® KIPO & WIPO 2007
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