| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which provides a cured product excellent in adhesion and thermal shock resistance and is suitable for electrical/electronic device materials such as a semiconductor sealing material and an underfill material. SOLUTION: The underfill material for semiconductor devices comprises an epoxy compound (A) obtained by co-hydrolysis condensation of alkoxy-silicon compounds represented by general formula (1) or of the alkoxy-silicon compound and an alkoxy-silicon compound represented by general formula (2), a curing agent (B), and a curing accelerator (C). The general formula (1) is XSi(OR<SP>1</SP>)<SB>3</SB>, wherein X denotes an organic group containing an epoxy group; and R<SP>1</SP>denotes a 1-4C alkyl group. The general formula (2) is R<SP>2</SP>Si(OR<SP>3</SP>)<SB>3</SB>, wherein R<SP>2</SP>denotes a 1-10C alkyl group, a 1-10C substituted alkyl group, an aryl group, a substituted aryl group, or an unsaturated aliphatic residue; and R<SP>3</SP>denotes a 1-4C alkyl group. COPYRIGHT: (C)2007,JPO&INPIT
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