| 摘要 |
A memory array module mounting structure is disclosed to include a main board, which has circuit contacts arranged thereon, a plurality of connectors installed in the main board and electrically connected to the circuit contacts of the main board, and a plurality of memory chips respectively detachably inserted into the connectors and kept electrically connected to the circuit contacts of the main board. Each memory chip can be removed from the respective connector for repair or replacement without reflow or desolder process when damaged.
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