COMBINATION IGBT MOUNTING METHOD

摘要

A system and method for providing a mechanical joint supporting a printed circuit board [12] and a solder joint of power module [20] terminals to a printed circuit board [12], as well as a mechanical joint [22] for facilitating a thermal interface between a power module [20] and a heat sink or cold plate is disclosed. The system provides for both mechanical joints through a common mechanical support including a plurality of standoffs mounted to studs [22] projecting from a heat sink or cold plate, wherein the assembly also provides for an insulating spacer [30] to be clamped to the standoffs [22] via a wing nut [32] or similar fastener to support me printed circuit board [12].