HEAT SPREADER, SEMICONDUCTOR PACKAGE MODULE AND MEMORY MODULE HAVING THE HEAT SPREADER

摘要

A heat spreader is provided to automatize an assembly process of a memory module by simply assembling a heat spreader in a PCB by a one-touch method. Heat of a body to be cooled is radiated by a heat radiation member(110). A fixing member(120) includes a press part(135), a hook part(151,152) and a support part(131,132,133,134). The press part is disposed on the heat radiation unit. The hook part is supported by the cooled body, extended from both ends of the press part. The support part comes in contact with the heat radiation unit, extended from the lateral surfaces of the press part. The press part is separated from the heat radiation unit wherein a bending space is formed between the press part and the heat radiation unit.