| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a highly reliable electronic part, and an electronic assembly which can be arranged closely each other. <P>SOLUTION: CMOS structures (20, 20') to form a circuit in semiconductor substrates (10, 10') are formed. After the CMOS structures (20, 20') have been formed in a low-temperature process, especially, in a process at 450°C or below; at least one electrical conductor (30, 30') is formed within an opening in the semiconductor substrates (10, 10'), for connecting the circuit between a first side (S1) and a second side (S2) of the semiconductor substrates (10, 10') opposite to the first side (S1). The electronic part allows a close arrangement of electronic circuits and sensors (80, 80'), and is suitable, especially, for a medical apparatus. <P>COPYRIGHT: (C)2007,JPO&INPIT |
