| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving a cured material having a very good balance of moisture resistance, heat resistance and light fastness, and excellent in colorless transparency, and especially the epoxy resin composition useful as a sealing material of an LED emitting a short wave length light. <P>SOLUTION: This epoxy resin composition comprises the following (A) and (B) components. The component (A): an epoxy resin obtained by directly hydrogenating an aromatic epoxy resin expressed by general formula (1) [wherein, R<SP>1</SP>to R<SP>4</SP>are each independently H, a 1-4C alkyl or a halogen atom; and (n) is 0-40 number] and having 0.5 to 50% hydrogenation ratio of its aromatic ring. The component (B): a curing agent for the epoxy resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |
