发明名称 CHIP-TYPE ELECTRONIC COMPONENT STORING MOUNT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a chip-type electronic component storing mount which has a strong releasing strength and suppresses fluffing from the mount when a cover tape is peeled off from the chip-type electronic component storing mount. <P>SOLUTION: In the chip-type electronic component storing mount comprising a multilayered paperboard, the surface layer is coated with a surface treating agent containing a water-soluble polymer and an alkenyl succinic anhydride derivative or an alkyl ketene dimer, and the water-soluble polymer includes at least one kind selected from polyvinyl alcohol, starch and polyacrylamide. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007001589(A) 申请公布日期 2007.01.11
申请号 JP20050181342 申请日期 2005.06.22
申请人 OJI PAPER CO LTD 发明人 YAMAMOTO MANABU;OKUYA TAKEHITO
分类号 B65D85/86;B32B29/06;B65D65/38;B65D73/02;D21H19/24;D21H27/10 主分类号 B65D85/86
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