发明名称 HEAT SINK FOR POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a heat sink for a power module which can realize the more improvement of radiation performance. SOLUTION: A power device is mounted on the surface side of the heat sink 1 for power module, and the heat from the power device is radiated with a cooling medium passing through a cooling passage 1d located inside. A corrugated fin 1a is located in the cooling passage 1d. In the corrugated fin 1a, mountains 21b and valleys 21c which extend in the passing direction of the cooling medium, and the side wall 21a which connects the mountains 21b and the valleys 21c are formed in wave-shape viewing in the passing direction. The fin 21 is composed of the mountain 21b or valley 21c and two adjacent side walls 21a. On each side wall 21a, a number of louvers 31 are formed which at least turn the cooling medium by its passing inside the fin 21. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007005673(A) 申请公布日期 2007.01.11
申请号 JP20050186077 申请日期 2005.06.27
申请人 TOYOTA INDUSTRIES CORP;SHOWA DENKO KK 发明人 KUBO HIDETO;KANEHARA MASAHIKO;FUJI TAKASHI;OTOSHI KOTA;KONO EIJI;TANAKA KATSUAKI;WAKABAYASHI NOBUHIRO;NAKAGAWA SHINTARO;FURUKAWA YUICHI;YAMAUCHI SHINOBU
分类号 H01L23/473 主分类号 H01L23/473
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