发明名称 EVAPORATION SOURCE, VAPOR DEPOSITION SYSTEM, AND VAPOR DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide an evaporation source where a thin film having a uniform film thickness can be deposited on the substrate to be film-deposited while retaining film deposition efficiency, and also to provide a vapor deposition system and a vapor deposition method. SOLUTION: The evaporation source is provided with: a vessel 1 where evaporation materials are stored; an evaporation material passage 3 connected to the vessel 1, and into which the materials evaporated in the vessel is made to flow; and opening parts 4a to 4d connected to the evaporation material passage 3 and for releasing the materials 1 to 4 from which the evaporated materials are released to the outside of the evaporation material passage 3. The opening parts for releasing the materials 1 to 4 are arranged in such a manner that the figure formed by the lines connecting the opening parts for releasing the materials 1 to 4 is made almost square. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007002291(A) 申请公布日期 2007.01.11
申请号 JP20050183197 申请日期 2005.06.23
申请人 UTEC:KK 发明人 ABE KOJI;HONDA YUJI
分类号 C23C14/24 主分类号 C23C14/24
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