发明名称 INJECTION MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an injection molding device capable of attempting to make the whole of the injection molding device small-sized by miniaturization of a plasticizing section of the injection molding device. SOLUTION: The injection molding device comprises a plasticizing section 2 for plasticizing a molding material 1 and an injection section 3 for receiving the molding material 1 which is plasticized at the plasticizing section 2 and supplying a given amount of the molding material 1 to a molding die 4. The injection section 3 is provided with a measuring section 6 in which a groove shaped space 5 to be filled by the molding material 1 above described, a closely contacted section 7 arranged to blockade the space 5 to be filled of the measuring section 6 described above and a movement section 8 arranged in the space 5 to be filled, and for increasing or decreasing the volume in a region to be filled with the molding material 1 by moving in the space 5 to be filled. Filling the molding material 1 in the space 5 to be filled can be done by adjusting a magnitude of the movement amount of the movement section 8 and a desired amount of the molding material 1 can be injected into the molding die 4. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007001267(A) 申请公布日期 2007.01.11
申请号 JP20050187263 申请日期 2005.06.27
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SUGITA TOSHIO;AZUMA KEIJI;MATSUO TAKASHI;MARUTA YUTAKA;KOBAYASHI AKIO
分类号 B29C45/46;B22D17/20;B29C45/17;B29C45/58 主分类号 B29C45/46
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