COMPOSITE MOLDING, ITS MANUFACTURING METHOD, AND FILM CAPACITOR

摘要

PROBLEM TO BE SOLVED: To solve the problem that a composite dielectric sheet mentioned in the patent document 1 can form a capacitor which can be incorporated into a substrate such as a printed board to improve heat resistance and a dielectric constant as the capacitor, but withstand voltage is insufficient as a capacitor to be used in a hybrid vehicle or a fuel cell vehicle, for example.

SOLUTION: A composite molding includes a porous molding containing an inorganic dielectric compound such as barium titanate and an organic binder compound such as polyethylene with a content of the inorganic dielectric compound of 50 wt.% or more, and thermosetting resin such as epoxy resin impregnated to fill part of a cavity of the porous molding.

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