发明名称 |
RESIN COMPOSITION, AND PREPREG, SUBSTRATE AND CONDUCTIVE FOIL-CLAD SUBSTRATE, USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a substrate suitable for high-frequency application, and having excellent heat resistance; and to provide the substrate obtained therefrom. <P>SOLUTION: The substrate 10 in a preferable embodiment has a resin layer 12 and a fiber base material 14 arranged in the resin layer 12. The resin layer 12 comprises a cured product of a resin composition, and the resin composition comprises a resin component containing a polyvinyl benzyl ether compound, and a phosphorus compound containing a reactive phosphorus compound including a benzene ring having a phosphorus atom and a vinyl group. The total content of the phosphorus atom contained in the phosphorus compound is ≥3.5 mass% and the content of the reactive phosphorus compound based on 100 pts.mass of the resin component is ≥20 pts.mass in the phosphorus compound and the resin component respectively in the resin composition. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007002191(A) |
申请公布日期 |
2007.01.11 |
申请号 |
JP20050187067 |
申请日期 |
2005.06.27 |
申请人 |
TDK CORP |
发明人 |
UCHIYAMA RYOTA;MORITA TAKAAKI |
分类号 |
C08L25/18;C08J5/24;C08K3/00;C08K5/49;D06M15/21;D06M15/356;H05K1/03 |
主分类号 |
C08L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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