发明名称 RESIN COMPOSITION, AND PREPREG, SUBSTRATE AND CONDUCTIVE FOIL-CLAD SUBSTRATE, USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a substrate suitable for high-frequency application, and having excellent heat resistance; and to provide the substrate obtained therefrom. <P>SOLUTION: The substrate 10 in a preferable embodiment has a resin layer 12 and a fiber base material 14 arranged in the resin layer 12. The resin layer 12 comprises a cured product of a resin composition, and the resin composition comprises a resin component containing a polyvinyl benzyl ether compound, and a phosphorus compound containing a reactive phosphorus compound including a benzene ring having a phosphorus atom and a vinyl group. The total content of the phosphorus atom contained in the phosphorus compound is &ge;3.5 mass% and the content of the reactive phosphorus compound based on 100 pts.mass of the resin component is &ge;20 pts.mass in the phosphorus compound and the resin component respectively in the resin composition. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007002191(A) 申请公布日期 2007.01.11
申请号 JP20050187067 申请日期 2005.06.27
申请人 TDK CORP 发明人 UCHIYAMA RYOTA;MORITA TAKAAKI
分类号 C08L25/18;C08J5/24;C08K3/00;C08K5/49;D06M15/21;D06M15/356;H05K1/03 主分类号 C08L25/18
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