| 摘要 |
Systems and methods for electrically isolating conductive members on an array of lead frames. In one embodiment, a system includes a stage for positioning the array to receive laser radiation, a computer system and electro-optical components. The system can sever conductive members from one another by laser ablation effected with programmable scanning of light from a laser. Software effects ablation paths along a plurality of lines across the array of lead frames. In a related method, the array is of a specified design and of the type formed on a sheet having a plurality lead frames interconnected through integrally formed dam bars. Reference information is provided to describe geometric or dimensional features, including predefined laser ablation scan paths for performing cuts along predefined cut lines on each lead frame. The cut lines are specific to the lead frame array design. Fiducial markings are located on the sheet. Laser ablation is performed to cut conductive members along the predefined cut lines, thereby completely severing at least some of the conductive members from an associated dam bar. |
