| 发明名称 |
PRESERVING SOLDERABILITY AND INHIBITING WHISKER GROWTH IN TIN SURFACES OF ELECTRONIC COMPONENTS |
| 摘要 |
<p>A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating. ® KIPO & WIPO 2007</p> |
| 申请公布号 |
KR20070006747(A) |
申请公布日期 |
2007.01.11 |
| 申请号 |
KR20067016728 |
申请日期 |
2006.08.21 |
| 申请人 |
ENTHONE INC. |
发明人 |
XU CHEN;ZHANG YUN;FAN CHONGLUN;KHASELEV OSCAR;ABYS JOSEPH A.;WALCH ERIC;KLEINFELD MARLIES;ECKERT HANS ULLRICH |
| 分类号 |
H01L23/495;C25D5/12;H01L21/02;H01L21/60;H01R4/02;H01R13/03;H05K1/03;H05K3/34 |
主分类号 |
H01L23/495 |
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