SEALING COMPOSITION

摘要

Disclosed is a sealing composition containing no lead which enables sealing at low temperatures and has a smaller coefficient of thermal expansion (thermal expansivity). The sealing composition does not substantially contain Pb and is composed of 80-98 weight% of a glass powder and 2-20 weight% of an inorganic filler containing a zirconium phosphate compound. The glass powder contains 70-85 weight% of Bi2O3, 4.5-10 weight% of B2O3, 8.0-20 weight% of ZnO and 0.1-1 weight% of Al2O3 in terms of oxides. ® KIPO & WIPO 2007