发明名称 LIQUID COOLING DEVICE FOR ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a compact and economical device exhibiting enhanced cooling efficiency. <P>SOLUTION: In a heat radiation circulation main loop 10, a liquid refrigerant of a refrigerant tank 14 is pressurized and fed by a main pump 16 and is made to flow to a cooling plate 18 for cooling electronic elements, and then the heat is radiated by a main heat exchanger 20, and the liquid refrigerant is returned to the refrigerant tank 14. In a heat radiation circulation sub loop 12, the liquid refrigerant of the refrigerant tank 14 is pressurized and fed by a sub pump 22, and the heat is radiated by a sub heat exchanger 24, and then the liquid refrigerant is returned to the refrigerant tank 14. A controller 26 controls a supply flow rate from the main pump 16 and the sub pump 22 as the need arises. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007003108(A) 申请公布日期 2007.01.11
申请号 JP20050184326 申请日期 2005.06.24
申请人 FUJITSU LTD 发明人 GI KETSU
分类号 F25D9/00;F25D17/02;G06F1/20;H01L23/473;H05K7/20 主分类号 F25D9/00
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