| 摘要 |
PROBLEM TO BE SOLVED: To provide soldering equipment that makes the extent of temperature deterioration small. SOLUTION: A local-flow soldering equipment comprises a soldering vessel housing a melted solder 2, and an opening 41a in an upper cylinder 41. The equipment prepares a nozzle, connecting to the soldering vessel in a lower cylinder 42, and a pump sending the solder 2 housed in the soldering vessel to the opening 41a of the nozzle in a pressurized manner. In order to join a through-hole 30a of printed circuit board 30 with a terminal 31a of electronic part threaded into the through-hole 30a, the solder 2 pressure fed to the opening 41a of the nozzle is made to be attached with the through-hole 30a and terminal 31a. The nozzle is arranged between the opening 41a and lower cylinder 42, and prepares an intermediate portion 43 having passage cross section smaller than that of the lower cylinder 42, and an outflow 41b making a part of the solder 2 that has passed through the intermediate portion 43, arranged in between the intermediate portion 43 and opening 41a flow out to the exterior of the nozzle. COPYRIGHT: (C)2007,JPO&INPIT
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