| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card capable of implementing normal test measurement and efficient test measurement on semiconductor integrated circuit chips by preventing contact failures of probe needles. SOLUTION: The probe card 1 brings second probe needles 30a-30d made of a metallic material harder than first probe needles 29a-29d to pads 32A-32D of a semiconductor integrated circuit chip 32 to be measured to break oxide films on the surfaces of the pads. Then the probe card 1 is moved in the direction of the arrangement of semiconductor integrated circuits of a wafer to bring the first probe needles 29a-29d having a higher electrical conductivity than the second probe needles 30a-30d into contact with the pads of the semiconductor integrated circuit chip 32. It is thereby possible to bring the first probe needles 29a-29d into contact with the pads of the semiconductor integrated circuit chip 32 with satisfactory electrical conductivity. COPYRIGHT: (C)2007,JPO&INPIT
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