| 摘要 |
PROBLEM TO BE SOLVED: To reduce a production cost while lessening the deformation and damage of a nozzle sheet. SOLUTION: The nozzle sheets 25 are arranged, respectively, so that nozzles may be located in a head-chip stationing hole 11b for each head-chip stationing hole 11b in the surface of one side of a module frame 11 and cover a part of the area of the head-chip stationing hole 11b, and the nozzle sheets are formed with the minimum size required for covering a part of the area of the head-chip stationing hole 11b. A flexible wiring substrate 3 is arranged so as to cover the exposed electrode of the head chip 20 in both sides wherein the nozzle sheets 25 of the module frame 11 are provided while its electrode being electrically connected to the electrode of the head chip 20. COPYRIGHT: (C)2007,JPO&INPIT
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