| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin inorganic composite sheet which is especially effective in coating on the active surface or the rear surface of a wafer for a semi-conductor, can drastically reduce a warping amount of a coating film after hardening which becomes a problem accompanying the enlargement of the diameter or the thinning of the wafer, and also, of which the film thickness precision is good, and which can form the coating film of a high strength. SOLUTION: An epoxy resin composition containing an epoxy resin and a filler is coated on the surface of a carrier material, and is heat-dried to obtain this epoxy resin inorganic composite sheet under a semi-hardened state. As the filler, X mass% (X=2 to 15) of a low elastic organic filler, and 70-X to 90-X mass% of an inorganic filler are used to the total amount of the epoxy resin composition. The thickness of the epoxy resin inorganic composite sheet which is formed on the surface of the carrier material is 5 to 200μm. COPYRIGHT: (C)2007,JPO&INPIT
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