METHOD FOR MANUFACTURING MULTI-LAYERED PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a multi-layered printed circuit board is provided to eliminate pollutants from a surface of a susplate by immersing the susplate polluted by an epoxy resin into a chemical solution. When susplates(114,116) are deposited on a wiring pattern made of a copper film formed on a multi-layered printed circuit board, the susplates are performed to a chemical processing process during a predetermined time, in which the susplates are immersed into a chemical solution to eliminate a pollutant(118), and the susplates are rinsed and dried. The chemical solution consists of glycol of 10 to 15%, amide of 60 to 70%, and carbitol of 20 to 25%.