| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive solder resist composition capable of giving a high-performance cured film excellent in heat resistance, resistance to moist heat, adhesion, mechanical characteristic, and electric characteristics and capable of being suitably used for producing a printed wiring board, a high-density multilayer plate, a semiconductor package, etc., and to provide a photosensitive solder resist. <P>SOLUTION: An elastomer is obtained by reacting a carboxy group-containing polyurethane which is obtained from a diisocyanate, a carboxylic acid group-containing diol, and a high-molecular diol having a mass-average molecular weight of ≥500 with a compound having an epoxy group and a vinyl group in its molecule, wherein a ratio of a total molar amount of a low-molecular diol having a mass-average molecular weight of ≤300 to a total molar amount of the high-molecular diol having the mass-average molecular weight of ≥500 is 0.5 to 10. Further, the photosensitive solder resist composition given by using the elastomer, a photosensitive solder resist film, a permanent pattern given by using the same, and a method for forming the same are provided, respectively. <P>COPYRIGHT: (C)2007,JPO&INPIT |
