| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing method that does not disturb wafer handling such as wafer transportation and enables through-holes (via holes) to be easily created. <P>SOLUTION: This method is intended to handle a wafer that comprises a device area with multiple devices on its surface, and a residue area surrounding the device area and forms electrodes in the device area. This method comprises a step for removing an area corresponding to the device area at the backside of the wafer in a way that the device area can be of the predetermined thickness, a step for leaving an area corresponding to a residue area at the backside of the wafer in a way that a circular reinforced part can be formed, and a step for drilling a through-hole (via hole) in the corresponding wafer electrode where the above reinforced part has been formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
