| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board on which electrodes can be arranged in a highly dense state while an electrode forming pitch and a wiring pitch are secured without being restrained by the size of an electrode connecting part, by employing such a constitution that the electrode connecting part to be connected to the electrode formed on one side of the board is formed on the other side of the board, and an inkjet head with high definition or many nozzle holes, which is equipped with the circuit board. SOLUTION: Second individual electrodes 31y and 31m are formed in two staggered arrangements on one side of a flexible sheet; and wiring 32y and wiring 32m, which are connected to the electrodes 31y and 31m, respectively, are arranged through a section between the second individual electrodes 31y and 31m in other adjacent arrangements. Electrode connecting parts 33y and 33m, which are connected to the electrodes 31y and 31m via through-holes 10y and 10m passing through the flexible sheet, are formed on the other side of the flexible sheet. The connecting parts 33y and 33m, which have areas larger than those of the electrodes 31y and 31m, are connected to external electrodes via solder H. COPYRIGHT: (C)2007,JPO&INPIT
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