发明名称 |
Package structure for a semiconductor device |
摘要 |
A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and connection protrude electrodes. The radiation protrude electrodes are formed on the back surface of the substrate in a chip area where said semiconductor chip is located. Each of the radiation protrude electrodes are formed with a first pitch so that the radiation protrude electrodes make one body joining layer when the package structure is subjected to a heat treatment. The connection protrude electrodes are formed on the back surface of the substrate in a peripheral area of the chip area. Each of the connection protrude electrodes formed with a second pitch which is larger than the first pitch so that the connection protrude electrodes stay individual when the package structure is subjected to a heat treatment.
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申请公布号 |
US2007008704(A1) |
申请公布日期 |
2007.01.11 |
申请号 |
US20060521554 |
申请日期 |
2006.09.15 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
ANDOH SEIJI |
分类号 |
H01L23/12;H05K7/20;H01L21/60;H01L23/31;H01L23/36;H01L23/367;H05K7/10 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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