发明名称 Three-dimensional non-volatile SRAM incorporating thin-film device layer
摘要 A shadow RAM or "non-volatile SRAM" memory cell is implemented in a much smaller area by building the cell upward rather than outward. By stacking non-volatile storage devices above or below an SRAM cell, a smaller cell can be provided and result in a lower cost memory device. In certain embodiments, such a memory cell includes a pair of cross-coupled devices disposed on a first device layer and defining a pair of internal cross-coupled nodes, and a pair of non-volatile storage devices disposed on a second device layer above or below the pair of cross-coupled devices and coupled to the cross-coupled nodes.
申请公布号 US2007008776(A1) 申请公布日期 2007.01.11
申请号 US20050179360 申请日期 2005.07.11
申请人 SCHEUERLEIN ROY E 发明人 SCHEUERLEIN ROY E.
分类号 G11C11/34 主分类号 G11C11/34
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