发明名称 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
摘要 <p>A semiconductor device includes MOS transistors formed by doping a p-type substrate (4) with an impurity from its surface of. The semiconductor device comprises first and second MOS devices (1A, 1B) each having the p-type substrate (4) having the region directly below a gate layer (5) not doped with the impurity and an n-type diffusion region formed on the surface of the p-type substrate (4) circumscribed to the gate layer (5). The gate layer of the first MOS device (1A) is connected to the n-type diffusion layer of the second MOS device (1B), and the n-type diffusion layer of the first MOS device (1A) is connected to the gate layer of the second MOS device (1B), thereby constituting a first capacitance element.</p>
申请公布号 WO2007004258(A1) 申请公布日期 2007.01.11
申请号 WO2005JP12070 申请日期 2005.06.30
申请人 SPANSION JAPAN LIMITED;SPANSION LLC;SHIMBAYASHI, KOJI 发明人 SHIMBAYASHI, KOJI
分类号 H01L21/822;H01L21/8234;H01L21/8236;H01L27/04;H01L27/06;H01L27/088 主分类号 H01L21/822
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