| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily set a polishing rate for each region of a workpiece in a polishing (CMP) device wherein the polishing rate can be adjusted depending on each region of the workpiece. <P>SOLUTION: In this polishing device, the workpiece W is relatively moved while being pressed against a polishing pad 2 on a polishing plate by means of a polishing head. The polishing head comprises the main body 11, carrier 14 supported so as to be moved up and down, carrier pressing mechanism 12 for pressing the carrier toward the surface of the workpiece by carrier pressing force, liquid injection mechanism for injecting a liquid which provides the pressing force to the surface of the workpiece from the bottom face of the carrier, and controlling section 27 for controlling the carrier pressing mechanism and the liquid injection mechanism. The liquid injection mechanism includes a plurality of liquid sub-injection portions 15-18. When the injection pressures from some of the liquid sub-injection portions are changed, the controlling section controls the carrier pressing force so that the pressing force at the portions corresponding to the other liquid sub-injection portions may be the original one. <P>COPYRIGHT: (C)2007,JPO&INPIT |
