| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a curable silicone rubber composition giving a transparent cured product having sufficient adhesive strength to hardly adhesive materials for various packages composed of a thermoplastic material such as PPA and LCP and to electrodes made of a metal such as Ag, Au, Ni and Pd and provide a semiconductor device encapsulated with the cured material of the composition. <P>SOLUTION: The invention relates to a curable silicone rubber composition containing (A) an organopolysiloxane containing a vinyl group, (B) an organohydrogenpolysiloxane, (C) an aluminum metal-based polymerization catalyst, (D) a platinum group metal-based catalyst and (E) a tackifying component and a semiconductor device encapsulated with the cured material of the composition. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
