发明名称 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate processing system and a substrate processing method capable of suppressing an increase in costs and footprints and suppressing a decrease in yields and throughput in the substrate processing system that has first and second devices and performs a sheet processing on a plurality of substrates by the cooperation with the first and second devices. <P>SOLUTION: The substrate processing system 100 has the first device 50 and the second device 60 for performing a sheet processing on the plurality of substrates, allows a second processing step to be executed by the second device 60 after the first processing step by the first device 50, and allows a third processing step to be executed by the first device 50 after the second processing step. In the substrate processing system 100, the first device has a first control means 30 as a control means for conveying substrates, the second device has a second control means 40, and the first control means 30 or the second control means 40 acquires information related to processing time by other devices by communication and controls the conveyance of substrates between the first and second devices 50, 60 based on the acquired information. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007005334(A) 申请公布日期 2007.01.11
申请号 JP20050180089 申请日期 2005.06.21
申请人 TOKYO ELECTRON LTD 发明人 KANEKO TOMOHIRO;MIYATA AKIRA
分类号 H01L21/027 主分类号 H01L21/027
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