| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a magnetic sensor device that can be mounted on compact and thin electronic equipment, can be packaged easily, and can maintain stable detection precision by restraining packaging space. <P>SOLUTION: A magnetic sensor circuit comprising a Hall element and an amplification circuit, and a projecting electrode 16 for external connection formed by solder bump 15 are provided on one surface of a silicon chip 12 that constitutes the magnetic sensor device 11 for surface-mounting via the projecting electrode 16. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
