| 摘要 |
PROBLEM TO BE SOLVED: To provide a supporting body for semiconductor substrates which is used as a heat-treatment jig for large-diameter semiconductor substrates, and can prevent a silicon wafer from slipping, when subjecting it to heat treatment, and further, prevent generation of particles, and moreover, whose lifetime is improved. SOLUTION: In the supporter for semiconductor substrates, the surface of the silicon plate of a silicon substrate is made porous so as to coat further its porous surface with a silicon carbide layer. The silicon carbide layer generated on its surface is so formed as to penetrate, even down to the insides of its fine holes and as to be fully embedded even in the insides of its fine holes. COPYRIGHT: (C)2007,JPO&INPIT |
