| 摘要 |
PROBLEM TO BE SOLVED: To provide, according to the present invention, a resin composition for a flexible printed wiring board, which enables to achieve both excellent heat resistance and high adhesiveness between an insulating resin and a copper wiring for a flexible printed wiring board. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a hardener for epoxy resins, (C) a hardening accelerator, (D) a triazinedithiol derivative, (E) an age resister for rubber, (F) a synthetic rubber, and (G) an inorganic filler, as essential components, and is obtained by mixing (D) the triazinedithiol derivative and (E) the age resister for rubber each at 0.1 to 5 parts by mass per 100 parts by mass of (F) a synthetic rubber. COPYRIGHT: (C)2007,JPO&INPIT |
