| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive material for connecting parts, in which plated multi-layers are formed on the surface of a base metal made of Cu or a Cu alloy, and which keeps low contact resistance in a high-temperature atmosphere for a long period of time. SOLUTION: On the surface of the base metal of Cu or the Cu alloy, the plated layers comprising an Ni layer, a Cu-Sn alloy layer and an Sn layer are formed in this order, wherein the Ni layer has a thickness of 0.1 to 1.0μm, the Cu-Sn alloy layer has a thickness of 0.1 to 1.0μm and Cu concentration of 35 to 75 at%, and the Sn layer has a thickness of 2.0μm or thinner and contains carbon of 0.001 to 0.1 mass%. When the material has an Sn layer with a thickness of 0.5μm or thinner, it has lower insertion force when it is used as a multi-pole fit type terminal, and when it has the Sn layer thicker than 0.5μm, it has an ensured wettability with solder even after receiving a heat treatment such as reflow soldering, and is suitable for non-fit type connecting parts such as JB. COPYRIGHT: (C)2007,JPO&INPIT
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